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Dow Corning 6811 |
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1-part black heat cure, flowable, self-priming adhesion, DRAM grade. Good flowability encapsulant for chip scale or other microelectronic packages that require DRAM-grade purity and vacuum dispensability. |
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One or two part: 1 Color: Black Viscosity/Flowability (poise): 350 Durometer: 60 A Specific Gravity: 1.25 Working Time RT: >48 hrs Heat Cure Time: 30 min/150'C Young's Modulus (M Pa): 2.7 Unprimed Adhesion Lap Shear (psi): 800 |
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There are no existing companies to distribute selected chemical product |
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