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DCU-O |
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Copper |
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Copper Nanoparticles in Toluene Solvent |
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7440-50-8 |
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PCB electrode seed layer PCB pattern repairing materials |
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Size Distribution : 30~100 D50(nm,PSA) : 47.34 Metal Contents(wt%) : On Demand Solvent : Toluene etc(Non-Polar Solvents) Resistivity(µ ¥Ø¡¤§¯) : <12.0 Curing Method : Photonic Sintering Substrate : Plastic Films |
Industrial field |
others, inorganic chemicals, solvents, additive, biocide, fungicide, cosmetics |
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There are no existing companies to distribute selected chemical product |
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