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| Dynasolve FS8200 |
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Dynasolve FS8200 is a high-strength aqueous formula designed as an alternative to the semi-aqueous FS8110 to remove flux residues from wafer bumps found in microelectronic packaging.
It is effective at removing flux and solder sputter while simultaneously leaving the solder bumps a bright finish with no etching.
It is also effective in the removal of a variety of baked-on flux residues.
Dynasolve FS8200 can be used in most in-line and batch aqueous and semi-aqueous equipment including ultrasonics.
For spray applications, use Dynasolve FS8205.
*Application: through-hole, surface mount, post-reflow or wave-solder, flip chip/BGA packaging |
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Appearance: amber liquid
Flash point: >175'F/ 80'C
Specific gravity: 0.912
Surface tension: 21.90 dynes/cm
Viscosity: 20 cp |
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