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Dynasolve SP9205
Dynasolve SP9205 is an aqueous-based blend of surface-active materials that are formulated to provide excellent cleaning without the use of solvents or alkalinity sources.
This product is designed for screen printing applications for the removal of uncured solder pastes and surface mount adhesives from stencils and misprinted circuit board assemblies.
It is a non-flammable product that contains no VOC¡¯s and is pH neutral.
Dynasolve SP9205 is a low-foam version of Dynasolve SP9200 and can be used in high-pressure spray applications.
*Application: stencils, fingers, misprints, screen printer, assemblies, through-hole & surface mount electronics.
Appearance: clear to light amber liquid
pH, 1% in DI water: 7-8
Specific gravity: 1.034
Viscosity: 80 cps (concentrate)
Foam: low foam
Industrial field others
Dynaloy, Inc
Phone 800.669.5709
Fax 800.671.9583
Homepage www.dynaloy.com
E-mail info@dynaloy.com
Address P.O. Box 33609 1910 S. State Avenue Indianapolis, IN 46203
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