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Chemical Information Overview  |  Chemical Product  |  Chemical Raw Material  |  Chemical Company
CMP POLISHING SLURRY
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so,water
Features£º
¡Ü High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
¡Ü Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
¡Ü High purity: the content of Cu2+£¼50 ppb, without contamination on the work piece
¡Ü Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface
GRISH Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity de-ionized water, highly engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on the pH.
GRISH CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. GRISH supplies CMP polishing slurry to customers around the world and is the most competitive in quality and price.
Industrial field others
Beijing Grish Hitech Co., Ltd.
Phone 0086-10-51653168
Fax
Homepage http://www.bjgrish.com
E-mail jinlifang@bjgrish.com
Address Rm401,Block C,Zhongguancun Development Building, No.12 Shangdi information Rd.,Haidian District,Beijing,China 100085
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